2023/04/11(二),09:00-12:00（北+南+視）
■語言：日文演說，中文逐步口譯。
■內容：
主講人先後提供【日文中譯】及【英文】兩版課網說明，皆公布如下供學員了解研討內容及講師專長，本次研討內容以英文版課網為主。
【英文版課網】
Recently, silicon photonics (SiPh) technology has gained considerable attention owing to the growing need for high-bit-rate optical interconnections. However, the low optical coupling efficiency between SiPh chips and single-mode optical fibers (SMFs) remains a challenging issue. The spot size of SiPh chips is typically enlarged to f 3–4 µm from the submicron scale using a spot size converter (SSC) integrated in the SiPh chips. However, these spot sizes are maximum by using conventional silicon technology, although the spot size of SMFs is approximately f 10 µm.
We are studying special schemes to adjust the spot size of SiPh chips and SMFs. The material used is polymer UV curable resin. Our unique fabrication methods are Self-Written Waveguide (SWW) Method and Mask Transfer Method. We have two approaches for spot size adjustment by using these methods; one is Spot Size Converter fabricated on SMF end face for down-sizing from f 10 mm to f 3 mm, and the other is Spot Size Expander on SiPh chip making spot size from f 3 mm to f 10mm. These fabrication methods are simple and inexpensive without the need for expensive silicon processing equipment and complicated processing. In the seminar, detail of our approaches and successful results will be shown.
This Seminar will cover the following subjects:
1. Introduction:
a).Why silicon photonics (SiPh) chip is a key device?
b).What is the problem in optical coupling between SiPh chip and single mode fiber (SMF)?
2. Two possible approaches:
a).Spot Size Down-Converter on SMF (f10 mm to f3 mm)
b).Spot Size Expander on SiPh chip (f3 mm to f10 mm)
3. Key Material for making Coupling Devices: Polymer/UV-Curable Resin
4. Unique Fabrication Method of Optical Coupling Devices
a).Self-Written Waveguide Method (SWW)
b).Photomask Transfer Method
5. Spot Size Down Converter on SMF end face (f10 mm to f3 mm)
a).Taper Pillar fabricated from HiNA fiber
b).Taper Pillar fabricated from SMF
c).Combination of Pillar and Micro Lens
6. Spot Size Expander on SiPh Chip end face (f3 mm to f10 mm)
Combination of Pillar and Micro Lens
【中譯版課網】
作為實現未來高速大容量光網路的關鍵元件之一，矽光子晶片(SiPh, Silicon photonics chip)備受關注。為了使SiPh內的光配線和網路中使用的單模光纖 (SMF: Single Mode Fiber)能高效率連接，不可或缺的動作是必須讓SiPh和SMF兩個端面的光點尺寸一致。
本課題將介紹國內外研究機構為此目的而進行的工作，同時介紹「使用UV固化樹脂和自發性生成光波導(SWW: Self-Written Waveguide)的製作技術」，希望對從事該領域研究開發的人有所幫助。
1．矽光子晶片與光纖的連接方式
1.1表面結合
1.2端面結合
2．結合元件的製作技術與材料
2.1 UV硬化樹脂
2.2自發性生成波導技術
2.3遮罩轉印技術
3．Spot Size Down Converter :光纖端的措施
3.1錐形柱結構(taper pillar)
3.2柱狀微透鏡結構(Pillar micro lens)
4．Spot Size Up Converter：矽光子晶片端的措施
4.1柱狀微透鏡結構
■主講人
日本業界專家／現任University Teknologi Malaysia(UTM), Guest Professor
■報名洽詢：(02)2536-4647#10張小姐(電子郵箱sumken@sum-ken.com)
■優惠方案
-線上：5,500、3,200、2,800元/1、3、5人
-實體：3,600、3,200、2,800元/1、3、5人
※ 請於開課日期【前7天完成繳費】，中國信託銀行(822)城北分行 657-540116548三建資訊有限公司※