（一）光子封裝突破銅導線頻寬（語言：中文）

（二）The Development of Photonic-Electronic Packaging Technologies and the Transition from Research to Manufacturing（語言：英文）

This presentation will provide an overview of the development and commercialization of photonic-electronic packaging technologies. Prof. Peter O’Brien will discuss the challenges and opportunities in transitioning from research to pilot-scale manufacturing, highlighting the importance of collaboration between academic institutions and industry partners in helping to build the complete ecosystem. The presentation covers various aspects of photonic packaging, including design considerations, fabrication techniques, advanced packaging equipment and workforce training. Additionally, Prof. O’Brien will discuss the potential applications of photonic packaging in areas such as data centers, telecommunications, medical devices and sensing. The future of photonic-electric packaging and the potential for continued innovation and growth in the field will also be discussed.
演講內容概述光電封裝技術開發和商業化。Prof. Peter O’Brien將討論從研究至先導工廠中面臨的挑戰和機遇，強調學術機構和產業合作夥伴之間協作建立完整生態系的重要性。內容涵蓋光子封裝各個方面，包括設計考量、製造技術、先進封裝設備甚至人員培訓。更進一步，Prof. O’Brien還將探討光子封裝在數據資料中心、電信、醫療設備和感應等領域的潛在應用，介紹未來性及該領域持續創新和增長的潛力。